7nm Physical design Challenges

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In the advanced process technologies of 7nm and beyond, the semiconductor industry faces several new challenges:

  1.  Aggressive chip area scaling with economically feasible process technology development,
  2. Sufficient performance enhancement of advanced small-scale technology with significantly increased wire and via resistances,
  3. Power density sustainability with ever shrinking chip area,
  4. Advanced chip packaging integration solutions for complex SOC systems.

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